Hot Keywords:
PRODUCTS CENTER
- Aluminum electrolytic capacitor
- Bolt type Ox horn type Lead type Patch type Unpolarized capacitor Horizontal capacitor Fixed product Solid state capacitance Solid-liquid mixed capacitor Ultracapacitor
- TOSHIBA
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- MOSFET
- Bipolar Transistor/IGBT/IEGT
- diode
- Optical semiconductor
- Universal Linear IC
- Universal Logic IC
- sensor
- Micro controller
- Customized SoC
- IC for Wireless
- Vehicle components
- Image Recognition Processor Visconti™
- Special Image Processing IC for Vehicle Display
- Vehicle Audio IC
- Power Amplifier IC
- Vehicle Microcontroller
- simulation ASSP
- Vehicle Motor Driver
- Power Supply for Vehicle System
- Vehicle Communication RF-IC
- Special IC for Vehicle Communication Service (ETC/DSRC)
- vehicle MOSFET
- vehicle IPD
- Storage Solution of Automotive Information and Entertainment System
- Vehicle Bridge Chip
- Small packaged on-board components
- Vehicle optocoupler/optical relay
- Dedicated IC
- High frequency device
- Packaging and Packaging
- Product naming rules
simulation ASSP
为满足在汽车电子系统上的众多需求，东芝公司提供了一套模数混合集成电路，将模拟、数字和功率器件集成在同一个芯片上。
东芝的0.13-μm BiCD工艺可以集成模拟电路与大的逻辑及功率（DMOS）器件于同一芯片。BiCD工艺有助于降低汽车系统的尺寸和功耗。随着电动汽车（EV）和混合动力车（HEV）的计算机化日益加强，市场对于电机和其它应用所需电子器件的需求也在增加。除了0.13-μm BiCD工艺，东芝也提供具有各种额定电压和电流的模拟器件，以及优化用于各种应用的电路技术。
- 东芝公司模拟器件的应用领域
Product lineup
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