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Bluetooth®Wireless Technology IC
两款符合Bluetooth® Ver.5.0的全新IC于2018年1月底开始付运。
东芝电子元件及存储装置株式会社宣布，其Bluetooth®低能耗IC产品阵容新增具有内置闪存ROM的“TC35680FSG”和不具有内置闪存ROM的“TC35681FSG”，样品运输将于2018年1月底开始。
- 点此了解TC35680FSG（内置Flash ROM）产品规范
- 点此了解TC35681FSG（无内置Flash ROM）产品规范
Bluetooth®经典／低能耗双型和Bluetooth®低能耗（LE）器件被广泛应用于音频、移动、可穿戴式和医疗保健设备。不久的将来，Bluetooth经典／低能耗双型和Bluetooth®低能耗器件将实现越来越普遍的应用。十年多以来，东芝始终作为蓝牙技术联盟（SIG）（注1）的发起人和倡导者，致力于实现蓝牙解决方案的更广泛应用。东芝是蓝牙连接性IC和原始蓝牙协议和配置文件的主要来源。
（注1：SIG负责蓝牙标准的编制、蓝牙技术和制造商商标的许可）
Bluetooth®标准和产品阵容
*Bluetooth®是Bluetooth SIG, Inc.公司的注册商标。
*部份内容转自Bluetooth® SIG网站。
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